a). What is an exhaustive test? b).A combinational logic circuit has 18 binary i

Question

a). What is an exhaustive test?

b).A combinational logic circuit has 18 binary inputs. Assuming it takes 50s to input one test pattern and record the circuit’s output, how long will it take to
do an exhaustive test?

c). What is a “stuck-at” fault? Show an example of a stuck-at 0 fault.

d). What are the two problems with trying to conduct an exhaustive test?

e).Page 49 of the 7 March lecture notes shows how 4 memory chips are
interfaced to an abstract microprocessor. Find the addresses allocated to each of
the 4 memory chips.

f). One of your co-workers claims the test pattern set you’ve been using has
49% fault coverage. What does that mean?

Explanation / Answer

a) What is an exhaustive test?

Exhaustive testing is a testing or excellence declaration approach in which all possible combinations of scenario and use/test cases are use for testing. In testing software, it is all the potential combinations of every type of input as well as every permutation and difference of how the input is carried out to ensure that all works as predictable. This goes the same for hardware testing—imperative any and all combinations of buttons and switch to determine which ones depiction a bug so that it can be set.

b) A combinational logic circuit has 18 binary inputs. Assuming it takes 50s to input one test pattern and record the circuit’s output, how long will it take to
do an exhaustive test?

Each input can be either ‘1’ or ‘0’ there are 18 such inputs

Therefore total number of test input possible=2*2-----*2 =2 power of 18 each pattern takes 50ms so total time required =2 power of(18*50*(10power of -3)=13107.2sec=3.64088hours

d) What are the two problems with trying to conduct an exhaustive test?

Usually a wafer consists of numerous dies which are then cut and each Is packaged unconnectedly. But before the packaging the dies are tested for their useful rightness. Exhaustive methods are one such method for performing this functional test on the dies. In this method all dies are checkered independently and none of the die on the wafer is left out from it If a die fail a test then an ink dot is Placed on it representative it to be a faulty one. Since every die is tested sort is a very time consuming method. It’s not a practical method as it takes a very large amount of time. There is other method which have a probabilistic way of determining which die to test on wafer and thus want much less time. After packaging, the ICs are checked for a success of packaging process. In this number of tests are performed which are common to the exhaustive test. It means that the same tests are performed twice and this result cost increase and also expenditure of time Thus exhaustive test Is not fundamentals the excellence of the final produce or the packaged product.

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