QUESTION 14 2.5 points Save Answer Which one is not a real factor for silicon to

Question

QUESTION 14 2.5 points Save Answer Which one is not a real factor for silicon to be preferred material for the fabrication of ICs? a. Higher electrical performance (mobility) .Abundance in nature O C. High-level purity O d. Availability of native-oxide (SIO2) e. Production of large wafer size QUESTION 15 2.5 points Save Answer What is the most common wafer size used in the fabs today? a, 4" or 100mm b. g or 200mm O C 12" or 300mm o d.6" or 150mm e 18" or 450mm QUESTION 16 2.5 points Save Answer Which statement about interconnects on a chip is absolutely correct? a. Always made from metal o b. May incorporate many layers c. Is the simplest step in fabrication O d. Has no influence on the operation e Is the very last layer to be built

Explanation / Answer

Answer :- 14) Option A is the correct answer. Silicon has less mobility than germeium. Rest all options are correct.

Answer :- 15) Option C is the correct answer. 300 mm wafer size is common in fabs.

Answer :- 16) Option A is the correct answer. Interconect is always made of metal.

Answer :- 3) The four steps are-

1. Wafer formation :- The process of making silicon wafer or slice.
2. Masking and Etching :- Masking is to protect some area while working on other area of wafer.
3. Doping :- Doping is done for changing the electrical properties if the wafer as per requirement.
4. Metallization :- To create interconnects.

Answer :- 4) Donors are n-type impurities from group15 that provide electrons and Acceptors are p-type impurities from group13 that provide holes.

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