In semiconductor manufacturing, wet chemical etching is oftenused to remove sili

ID: 2916177 • Letter: I

Question

In semiconductor manufacturing, wet chemical etching is oftenused to remove silicon from the backs of wafers prior tometalization. The etch rate is an important characteristic in thisprocess and known to follow a normal distribution. Two differentetching solutions have been compared, using two random samples of10 wafers for etch solution. The observed etch rates are as follows(in mils/min):

Round your answer to 4 significant digits.

Test statistic:

Conclusion: RejectFail to reject H0.

the tolerance is +/-2%

Solution 1
Solution 2 9.8 10.4
10.4 10.0 9.4 10.3
10.6 10.2 9.3 10.0
10.7 10.7 9.6 10.3
10.4 10.4 10.2 10.1
10.5 10.3

Explanation / Answer

Ans:

Test statistic:

t=(9.94-10.42)/SQRT((0.395^2/10)+(0.22^2/10))

t=-3.3570

Reject the null hypothesis.

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In semiconductor manufacturing, wet chemical etching is often used to remove sil

In semiconductor manufacturing, wet chemical etching is oftenused to remove sili

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In semiconductor manufacturing, wet chemical etching is oftenused to remove sili

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