From this figure: fill in the table following the directions below, describing t
ID: 3142114 • Letter: F
Question
From this figure: fill in the table following the directions below, describing the photolith process shown. Fill in the table following the directions below, describing the photolith process shown.
In the second column, indicate which of the following ten processing steps is done:
Process Steps (listed in random order below):
etch
photoresist removal (strip)
final inspection
alignment and exposure
surface preparation
inspect development
photoresist application
photoresist development
hard bake
soft bake
Indicate the purpose of each step by placing the letter (a, b, c…) in the third column. Chose from:
Purpose of Each step (listed in random order below)
Inspect surface for alignment and defects
Additional evaporation of solvents
Top layer of wafer is removed through opening in resist layer
Clean and dry wafer surface
Precise alignment of mask/reticle to wafer and exposure of photoresist.
Spin coat a thin layer of photoresist on the wafer
Remove photoresist layer from wafer.
Surface inspection for etch irregularities and other problems.
Partial evaporation of photoresist solvents by heating.
Removal of unpolymerized photoresist.
Schematic Wafer Wafer t t t t Wafer Wafer wafer Wafer Wafer Wafer Wafer Wafer Process Step 10 PurposeExplanation / Answer
The directions below, describing the photolith process shown as :
Order
Process Steps:
Purpose of Each step
1
Surface preparation
Clean and dry wafer surface
2
Photoresist application
Spin coat a thin layer of photoresist on the wafer
3
Soft bake
Partial evaporation of photoresist solvents by heating.
4
Alignment and exposure
Precise alignment of mask/reticle to wafer and exposure of photoresist.
5
Photoresist development
Removal of unpolymerized photoresist.
6
Hard bake
Additional evaporation of solvents
7
Inspect development
Inspect surface for alignment and defects
8
Etch
Top layer of wafer is removed through opening in resist layer
9
Photoresist removal (strip)
Remove photoresist layer from wafer.
10
Final inspection
Surface inspection for etch irregularities and other problems.
Order
Process Steps:
Purpose of Each step
1
Surface preparation
Clean and dry wafer surface
2
Photoresist application
Spin coat a thin layer of photoresist on the wafer
3
Soft bake
Partial evaporation of photoresist solvents by heating.
4
Alignment and exposure
Precise alignment of mask/reticle to wafer and exposure of photoresist.
5
Photoresist development
Removal of unpolymerized photoresist.
6
Hard bake
Additional evaporation of solvents
7
Inspect development
Inspect surface for alignment and defects
8
Etch
Top layer of wafer is removed through opening in resist layer
9
Photoresist removal (strip)
Remove photoresist layer from wafer.
10
Final inspection
Surface inspection for etch irregularities and other problems.
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