In semiconductor manufacturing, wet chemical etching is often used to remove sil

Question

In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils/min): Test the hypothesis H_0: sigma^2_1 = sigma^2_2 against H_1: sigma^2_1 not equal to sigma^2_2 using alpha = 0.05. Round your answer to 3 decimal places (e.g. 98.765). Test statistic: Conclusion:

Explanation / Answer

from above

test stat =s12/s22 =0.2001/0.0533=3.7521

as for 0.05 level; f critical =2.9782

as test stat is in rejection region we reject null hypothesis

sol 1 sol 2 9.5 10.2 9.4 10.6 9.3 10.7 9.6 10.4 10.2 10.5 10.6 10 10.3 10.2 10 10.7 10.3 10.4 10.1 10.3 Variance 0.2001 0.0533 s1^2 s2^2

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