1- Define the term, “ESD.” Be specific here; don’t simply decode the acronym! 2-
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Question
1- Define the term, “ESD.” Be specific here; don’t simply decode the acronym!
2- The following are three classifications of ESD control. Define and give an example of each.
a) Prevention of static charge build-up
b) Safe dissipation charge build-up
c) Improvements in the ESD robustness of the product
3- Define Static Electricity.
4- What test of ESD equipment should be performed, how often, and per what standard?
5- The main board in the PC that you will be working with is an Asus P5AD2-E-Premium motherboard with an Intel Pentium 4 – 3.4 GHZ processor. Using Internet resources, answer the following questions.
a) What central processors are supported by this board (only list 4 as there are a lot!) and what is the connection type/socket to the main board?
b) What part of the chip set is used for the I/O?
c) How many and what type of IDE/SATA controllers does this board have?
d) How many IDE/SATA devices can each of the controller(s) service?
e) What other internal and external ports or interfaces does this board have and how many of each?
f) What type and how much RAM does this board support?
g) What is the front-side bus (FSB) speed and why is it important?
7- Why are motherboard specifications, in general, important?
Explanation / Answer
1) ESD : Electrostatic discharge is the sudden flow of electricity between two electrically charged objects caused by contact, an electrical short, or dielectric breakdown.
2) a) Prevention of static charge build-up: This helps in prevention of static charge buildup. This means that charge is not allowed to build up in the product. Ionization systems help to neutralize charged surface regions on insulative or dielectric materials. The use of conductive filaments on garments worn by assembly workers, conducting wrist straps and foot-straps to prevent high voltages from accumulating on workers' bodies, anti-static mats or conductive flooring materials to conduct harmful electric charges away from the work area, and humidity control.
b) Safe dissipation charge build-up: If prevention is not possible, we try to dissipate the build-up charge. An efficient way to prevent ESD is to use materials that are slowly conduct static charges away. These materials are called static dissipative and have resistivity values in the range of 105 to 1012 ohm-meters. Materials in automated manufacturing which will touch on conductive areas of ESD sensitive electronic should be made of dissipative material, and the dissipative material must be grounded.
c) Improvements in the ESD robustness of the product: There has been lot of research undergone to devise standard for ESD prevention. For testing the susceptibility of electronic devices to ESD from human contact, an ESD Simulator with a special output circuit, called the human body model (HBM) is often used. A charged device model (CDM) test is used to define the ESD a device can withstand when the device itself has an electrostatic charge and discharges due to metal contact. Other standardized ESD test circuits include the machine model (MM) and transmission line pulse (TLP).
3) Static electricity is an imbalance of electric charges within or on the surface of a material. The charge remains until it is able to move away by means of an electric current or electrical discharge. A static electric charge is created whenever two surfaces contact and separate, and at least one of the surfaces has a high resistance to electric current.
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