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ID: 1847295 • Letter: B
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Compare the major hardware and software features of the iPhones and Samsung S5 in terms of the following: How does a Hard Disk Drive (HDD) work? Describe and compare SRAM and DRAM memories. Where are they used? What is a cache memory? Write about the three levels of cache memories (L1, L2, L3) and compare them. Went about the different levels of integrated circuit technologies (such as SSI, Went a detailed report on Intel's IC fabrication technology. How will nanotechnology change the electronics industry? Do not copy-paste directly from the internet. Read, understand, and then summarize. Present as many details as you can, including diagrams, figures, tables, etc.Explanation / Answer
1. A7 64-bit processor
16GB, 32GB, 64GB
iOS7
8Mp and 1.2Mp cameras
4in display
123.8x58.6x7.6mm, and it weighs just 112g
2. . Basically, there are discs, one on top of the other spaced a few millimetres apart. These discs are called platters. Polished to a high mirror shine and incredibly smooth they can hold vast amounts of data.
Next we have the arm. This writes and reads data onto the disc. It stretches out over the platter and moves over it from centre to edge reading and writing data to the platter through its tiny heads which hover just over the platter. The arm, on the average domestic drives can oscillate around 50 times per second. On many high-spec machines and those used for complex calculations this figure can rise into the thousands.
Hard drives use magnetism to store information just like on old cassette tapes. For that reason, copper heads are used as they are easy to magnetise and demagnetise using electricity.
3. SRAM is a type of RAM that stores data using a static method, in which the data remains constant as long as electric power is supplied to the memory chip. This is different than DRAM (dynamic RAM), which stores data dynamically and constantly needs to refresh the data stored in the memory. Because SRAM stores data statically, it is faster and requires less power than DRAM.
However, SRAM is more expensive to manufacture than DRAM because it is built using a more complex structure. This complexity also limits the amount of data a single chip can store, meaning SRAM chips cannot hold as much data as DRAM chips. For this reason, DRAM is most often used as the main memory for personal computers. However, SRAM is commonly used in smaller applications, such as CPU cache memory and hard drive buffers. It is also used in other consumer electronics, from large appliances to small children's toys
4. cache memory is a high speed memory kept in between processor and RAM to increase the data execution speed. It is kept near to the processor.
There are different levels of cache.
L1-cache is the fastest cache and it usually comes within the processor chip itself.
The L1 cache typically ranges in size from 8KB to 64KB and uses the high-speed SRAM (static RAM) instead of the slower and cheaper DRAM (dynamic RAM) used for main memory.
The Intel Celeron processor uses two separate 16KB L1 caches, one for the instructions and one for the data.
L2 cache comes between L1 and RAM(processor-L1-L2-RAM) and is bigger than the primary cache (typically 64KB to 4MB).
L3 cache is not found nowadays as its function is replaced by L2 cache. L3 caches are found on the motherboard rather than the processor. It is kept between RAM and L2 cache.
So if your system has L1,L2 and L3 cache data fetching will be L1->L2->L3->RAM
ie. If data is not there in L1 it will check L2 then L3 then RAM
5.
Levels of IntegrationICs are categorized according to their circuit complexitywhich can be measured by the number of electronic components contained in thepackage.The process of integration can be classified as small, medium,large, very large, or super large.Small-Scale Integration (SSI) SSI devices contain several independent electronic
components in a single package.The inputs and outputs are connected directly to the pins in the package.The number of components is less than 10 in every package.Logic Gates like inverters, AND gate, OR gate and etc. are products of SSI.Medium Scale Integration (MSI) MSI devices has a complexity of 10 to 100
electronic components in a single package.They usually perform basic and specific digital operations and includesdecoders, adders, counters, multiplexers, and demultiplexers.Large Scale Integration (LSI) Products of LSI contain between 100 and
10,000 electronic components in a single package.They include memory modules, I/O controllers, and 4-bit microprocessor systems.Very Large Scale Integration (VLSI) Devices that are results of VLSI contain
between 10,000 and 300,000 electronic components.VLSI produces large memory modules and 8bit, 16-bit, and 32-bit microprocessorsystems.Super Large Scale Integration (SLSI) This kind is a new type of integration
whichproduces ICs having more than 300,000 electronic components in one package.Examples of devices which use SLSI are 64-bit microprocessor systems andmicrocontrollers
6. Intel New 45-nm Processor Fabrication Technique:
The implementation of high-k and metal materials marks the biggest change in transistor technology since the introduction of polysilicon gate MOS transistors in the late 1960s,'' said Intel co-founder Gordon Moore, in a statement.
''As more and more transistors are packed onto a single piece of silicon, the industry continues to research current leakage reduction solutions,'' said Mark Bohr, Intel senior fellow, in the same statement. ''Our implementation of novel high-k and metal gate transistors for our 45-nm process technology will help Intel deliver even faster, more energy efficient multi-core products that build upon our successful Intel Core 2 and Xeon family of processors, and extend Moore's Law well into the next decade
7. Improving display screens on electronics devices. This involves reducing power consumption while decreasing the weight and thickness of the screens.
Increasing the density of memory chips. Researchers are developing a type of memory chip with a projected density of one terabyte of memory per square inch or greater.
Reducing the size of transistors used in integrated circuits. One researcher believes it may be possible to "put the power of all of today's present computers in the palm of your hand
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